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Tensile response of adhesively bonded composite-to-composite single-lap joints in the presence of bond deficiency

机译:在粘结不足的情况下粘结复合材料对复合材料单搭接接头的拉伸响应

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摘要

This paper studies the quasi-static tensile response of adhesively bonded composite-to-composite single-lap joints in the presence of weak and kissing bonds, as an attempt for characterisation of bond deficiencies likely to occur in polymer composite bonded repair. Cytec FM®94 adhesive film (0.25 mm nominal thickness) was used for all joints to bond two 2mm-thickness carbon fibre polymer composite laminates manufactured from unidirectional Hexcel M21/T800S pre-pregs. Peel-ply surface treatment was used for all joints. The bonds were deteriorated via five methods: pre-curing the centre of bond area prior to the cure of the bond edges, increasing the curing temperature rate, reducing the curing time, and embedding PTFE films over the centre of the bond. For the last method, the studies were carried out by embedding PTFE films on one and two sides of the adhesive film. The bond deterioration was followed by non-destructive inspections using ultrasound C-scanning. The ultimate failure load of the joints with defected bonds (i.e. weak and kissing bonds) was measured and compared to that of the joints with no defect (i.e. good bonds). It was found that rapid curing and short-time curing reduces more than 50% of the load carrying capacity of the single-lap joins in tension while the joints with weak bonds introduced by pre-curing of a large area of the bond (>60%) can take up more than 65% of the ultimate load of the joint with good bond. Also, optical microscopy of the bond surfaces after failure showed changes in failure type for the rapid and short-time cure, strongly correlated with their significant failure load reduction.
机译:本文研究了存在弱键和接吻键的情况下,胶粘剂粘结的复合材料-复合材料单搭接接头的准静态拉伸响应,以此来表征聚合物复合材料粘结修复中可能出现的粘结缺陷。所有接头均使用CytecFM®94粘合膜(标称厚度为0.25 mm)粘合两个由单向Hexcel M21 / T800S预浸料制成的2mm厚度的碳纤维聚合物复合材料层压板。所有接缝均采用剥离表面处理。通过五种方法使粘合层劣化:在粘合边缘固化之前预固化粘合区域的中心,提高固化温度速率,减少固化时间,以及在粘合中心上嵌入PTFE膜。对于最后一种方法,研究是通过将PTFE膜嵌入粘合膜的一侧和两侧进行的。粘结劣化后,使用超声波C扫描进行无损检查。测量具有缺陷键(即弱键和接吻键)的接头的最终破坏载荷,并将其与没有缺陷(即良键)的接头的极限载荷进行比较。发现快速固化和短时固化会降低单圈搭接的50%的承载能力,而大面积(> 60)的预固化会引入具有弱粘结力的接头%)可以承受具有良好粘结力的接头极限载荷的65%以上。同样,破坏后的粘合表面的光学显微镜显示出快速和短时间固化的破坏类型的变化,与它们显着降低破坏负荷密切相关。

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